Method for solder application and reflow

Details Method for solder application and reflow Method for solder application and reflow

1992-01-02

1993-10-26

Rosenbaum, Mark

Metal fusion bonding

Process

Plural joints

228246, B23K 3102

Patent

active

052558398

ABSTRACT:
A method for applying solder on a substrate (12) comprises the steps of providing a substrate (12) having predefined solder pads (15) and then providing solder spheres (16) for suitable placement on the solder pads. Then applying flux (14) and tacking media (18) between the solder pads (15) and the solder spheres (16) and then placing the solder spheres on the solder pads. Subsequently the solder spheres are heated onto the solder pads of the substrate providing reflowed solder (26) on the solder pads. Then a layer of flux tacking media (28) is applied on the reflowed solder. Next, a component (30 or 40) is placed on the reflowed solder and flux tacking media providing a substrate assembly (10). Finally, the circuit assembly is heated allowing the component to be soldered to the solder pad.

REFERENCES:
patent: 2079710 (1937-05-01), Jacobson
patent: 3436818 (1969-04-01), Merrin et al.
patent: 3703254 (1972-11-01), Maierson et al.
patent: 4352449 (1982-10-01), Hall et al.
patent: 4720324 (1988-01-01), Hayward
patent: 4878611 (1989-11-01), Lo Vasco et al.
patent: 4994119 (1991-02-01), Gotierrez et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5108024 (1992-04-01), Kazem-Goudarzi et al.
"Solder Balls" catalog. Alloys Unlimited Inc.
Metals Handbook 9th ed. vol. 6, p. 13, 1084-1085.

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