Method for siphoning liquid from a plated object during plating

Details Method for siphoning liquid from a plated object during plating Method for siphoning liquid from a plated object during plating

1990-06-08

1992-01-14

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Controlling current distribution within bath

205151, C25D 300

Patent

active

050807625

ABSTRACT:
A siphon and method of immersion and removal of an object to be plated in a liquid for siphoning the liquid from a blind hole in the object. The siphon has a short leg in the blind hole and a long leg exterior of the hole and extending downwardly below the short leg. The siphon may be either non-conductive or conductive. If conductive, it can also serve as an auxiliary electrode in the plating process.

REFERENCES:
patent: 2083480 (1937-06-01), Spence
patent: 4935109 (1990-06-01), Dugan

Affiliated with

Also associated with

Rating

Method for siphoning liquid from a plated object during plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for siphoning liquid from a plated object during plating , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for siphoning liquid from a plated object during plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-539182