Method for single wafer processing in which a semiconductor wafe

Cleaning and liquid contact with solids – Processes – With work or work parts movable during treatment

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

134 33, 134 34, B08B 304

Patent

active

052307433

ABSTRACT:
A single wafer processor supports a semiconductor wafer having at least one surface that is to be subjected to contact with a fluid. The equipment includes a portable module including a gripper assembly that is rotatable about the axis of a portable housing and is capable of mechanically engaging or disengaging the edge of an individual wafer. The portable module is complementary to a receiving base having an open bowl provided with liquid jets for discharging processing liquids or reagents in parallel streams directed toward the outer surface of a rotating wafer. The bowl can also be filled with liquid for immersion treatment of a wafer, which can be held stationary or rotated at slow speeds. The portable unit is moved between base units by a robotic arm. All elements associated with holding of the wafer are physically shielded to minimize wafer contamination from environmental contact.

REFERENCES:
patent: 2081142 (1937-05-01), Branaman, Sr.
patent: 2994331 (1961-08-01), Companys
patent: 3614959 (1971-10-01), Schullmaier et al.
patent: 3950184 (1976-04-01), Adams et al.
patent: 4064885 (1977-12-01), Dussault et al.
patent: 4178188 (1979-12-01), Dussault et al.
patent: 4290687 (1981-09-01), Takahashi
patent: 4339297 (1982-07-01), Aigo
patent: 4429983 (1984-02-01), Cortellino
patent: 4457419 (1984-07-01), Ogami et al.
patent: 4510176 (1985-04-01), Cuthbert et al.
patent: 4519846 (1985-05-01), Aigo
patent: 4588185 (1986-05-01), Shoda et al.
patent: 4601627 (1986-07-01), Oka et al.
patent: 4745422 (1988-05-01), Matsuoka et al.
patent: 4827867 (1989-05-01), Takei et al.
patent: 4838979 (1989-06-01), Nishida et al.
patent: 4856641 (1989-08-01), Matsumura et al.
patent: 4923054 (1990-05-01), Ohtani

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for single wafer processing in which a semiconductor wafe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for single wafer processing in which a semiconductor wafe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for single wafer processing in which a semiconductor wafe will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2339862

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.