Method for single sided polishing of a semiconductor wafer

Details Method for single sided polishing of a semiconductor wafer Method for single sided polishing of a semiconductor wafer

1993-04-05

1995-02-14

Fourson, George

Fishing, trapping, and vermin destroying

437228, 437966, 437974, 156636, H01L 21302, H01L 2160

Patent

active

053895797

ABSTRACT:
A method for polishing a single side of a semiconductor wafer (31) is disclosed for improving wafer flatness. A protective layer (32) is formed on one side of the semiconductor wafer (31). The semiconductor wafer (31) is polished on both sides concurrently using double sided polishing equipment (38,41). The protective layer (32) prevents a surface (37) of the semiconductor wafer (31) from being polished while the other unprotected surface (36) is polished thereby producing a single sided polished wafer.

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