Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Simultaneous deplating and plating
Patent
1998-06-11
2000-11-07
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Simultaneous deplating and plating
205123, 205147, C25D 500
Patent
active
061431559
ABSTRACT:
Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
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Adams John A.
Krulik Gerald A.
Smith Everett D.
Gorgos Kathryn
Nicolas Wesley A.
SpeedFam IPEC Corp.
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