Data processing: structural design – modeling – simulation – and em – Electrical analog simulator – Of physical phenomenon
Reexamination Certificate
2008-02-06
2011-12-13
Shah, Kamini (Department: 2128)
Data processing: structural design, modeling, simulation, and em
Electrical analog simulator
Of physical phenomenon
C703S006000
Reexamination Certificate
active
08078438
ABSTRACT:
A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation.
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Gopinath et al. “An Integrated Methodology for Multiobjective Optimal Component Placement and Heat Sink Sizing”, IEEE vol. 28, No. 4, Dec. 2005.
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Wang et al. “3-D Thermal-ADI: A Linear-Time Chip Level Transient Thermal Simulator”, IEEE vol. 21, No. 21, Dec. 2002.
Cheng Yi-Lun
Wang Feng-Ku
Alhija Saif A
Inventec C'orporation
J.C. Patents
Shah Kamini
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