Method for sequentially processing a multi-level interconnect ci

Details Method for sequentially processing a multi-level interconnect ci Method for sequentially processing a multi-level interconnect ci

1982-08-19

1984-03-20

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

C23C 1500

Patent

active

044379617

ABSTRACT:
Apparatus and method for sequentially processing multi-level interconnections for microelectronic circuits are disclosed which includes a vacuum system having a vacuum chamber 12 in which wafers 20 are processed on rotating turntables 16 and 18. The vacuum chamber is provided with an RF sputtering system 24 and a DC magnetron sputtering system 28. A gas inlet 34 is provided in the chamber for the introduction of various gases to the vacuum chamber and the creation of various gas plasma during the sputtering steps. The rotating turntables 16, 18 insure that the respective wafers are present under the sputtering guns for an average amount of time such that consistency in sputtering and deposition is achieved. By continuous and sequential processing of the wafers in a common vacuum chamber without removal, the adverse affects of exposure to atmospheric conditions are eliminated providing higher quality circuit contacts and functional device.

REFERENCES:
patent: 4164461 (1979-08-01), Schilling
patent: 4351697 (1982-09-01), Shanefield et al.
W. H. Legat et al, "Application of Sputtering in the Fabrication of Semiconductor Devices," Solid State Technology, Dec. 1970, pp. 54-57.

Affiliated with

Also associated with

Rating

Method for sequentially processing a multi-level interconnect ci does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for sequentially processing a multi-level interconnect ci, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for sequentially processing a multi-level interconnect ci will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1602668