Method for separating wafers bonded together to form a...

Details Method for separating wafers bonded together to form a... Method for separating wafers bonded together to form a...

2007-09-04

2007-09-04

Lee, Hsien-Ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S455000, C438S458000

Reexamination Certificate

active

10947134

ABSTRACT:
This invention relates to a method for separating at least two wafers (1, 2) bonded together to form a stacked structure. At least one bending force is applied to all or part of the stacked structure to separate the stacked structure into two parts along a required separation plane.Application particularly for producing a thin semiconducting layer.

REFERENCES:
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patent: 5863375 (1999-01-01), Cha et al.
patent: 6429094 (2002-08-01), Maleville et al.
patent: 6756285 (2004-06-01), Moriceau et al.
patent: 2003/0077885 (2003-04-01), Aspar et al.
patent: 2004/0171196 (2004-09-01), Walitzki
patent: 1 908 597 (1969-09-01), None
patent: WO 2004/051735 (2004-06-01), None
Patent Abstracts of Japan, JP 61-145839, Jul. 3, 1986.

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