Method for separating semiconductor wafer from supporting...

Details Method for separating semiconductor wafer from supporting... Method for separating semiconductor wafer from supporting...

2008-07-01

2008-07-01

Loke, Steven (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S460000, C438S464000

Reexamination Certificate

active

07393757

ABSTRACT:
A work is suction-held by an upper suction chuck stage from the surface side of a supporting member, is moved upward to a predetermined height, and is heated in a state where the thickness direction of a both-faced adhesive sheet is not restricted, and a dicing tape is cooled. After lapse of predetermined heating time, the work is separated from the both-faced adhesive sheet whose adhesive strength is weaken, and drops to a lower suction chuck stage.

REFERENCES:
patent: 5476566 (1995-12-01), Cavasin
patent: 5576566 (1996-11-01), Kenney
patent: 6627037 (2003-09-01), Kurokawa et al.
patent: 2001/0049256 (2001-12-01), Arai et al.
patent: 1 061 559 (2000-12-01), None
patent: 08023025 (1996-01-01), None
patent: 2001-007179 (2001-01-01), None
patent: WO-03/001587 (2003-01-01), None
European Search Report dated Sep. 6, 2006 for Application No. 04020711.0-2203.

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