Method for separating semiconductor substrate

Details Method for separating semiconductor substrate Method for separating semiconductor substrate

2005-08-09

2009-06-23

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S460000, C438S462000, C438S464000, C257SE21001

Reexamination Certificate

active

07550367

ABSTRACT:
A method of separating a semiconductor substrate having an implementation member attached thereon includes a dividing process for at least the implementation member on the semiconductor substrate along a separation line, a placing process for film member on a same side as the implementation member, a forming process area by irradiating a laser beam from at least one of a first side of the semiconductor substrate having the implementation member and a second side that is an opposite side of the first side of the semiconductor substrate along the separation line with a focusing point of the laser beam aligned with a substance in the semiconductor substrate and severing/removing at least one semiconductor chip at the separation line from the semiconductor substrate.

REFERENCES:
patent: 4729971 (1988-03-01), Coleman
patent: 6117347 (2000-09-01), Ishida
patent: 6211488 (2001-04-01), Hoekstra et al.
patent: 6399463 (2002-06-01), Glenn et al.
patent: 6562698 (2003-05-01), Manor
patent: 6849524 (2005-02-01), Shelton et al.
patent: 6992026 (2006-01-01), Fukuyo et al.
patent: 7008861 (2006-03-01), Andrews et al.
patent: 7129114 (2006-10-01), Akram
patent: 7169687 (2007-01-01), Li et al.
patent: 7265033 (2007-09-01), Shigematsu et al.
patent: 2004/0002199 (2004-01-01), Fukuyo et al.
patent: 2005/0006728 (2005-01-01), Shizuno
patent: 2005/0082644 (2005-04-01), Ohkawa

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