Method for separating circuit dies from a wafer

Details Method for separating circuit dies from a wafer Method for separating circuit dies from a wafer

1992-07-22

1994-11-08

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437924, 437974, H01L 21304

Patent

active

053626818

ABSTRACT:
A method for separating individual dies from a wafer in which the wafer is adhered to a plastic film on a film carrier with the circuit side of the wafer facing the film and with circuit components exposed through a hole in the film. In this manner, the circuitry is protected from dust, and trauma from the sawing and cleaning processes because the circuitry is sealed between the film and the non-circuit side of the wafer.

REFERENCES:
patent: 3537169 (1970-11-01), Eigeman et al.
patent: 4138304 (1979-02-01), Gantley
patent: 4522679 (1985-06-01), Funakoshi et al.
patent: 4915565 (1990-04-01), Bond et al.
patent: 5171717 (1992-12-01), Broom et al.

Affiliated with

Also associated with

Rating

Method for separating circuit dies from a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for separating circuit dies from a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for separating circuit dies from a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1782322