Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-11-02
2010-02-16
Nguyen, Khiem D (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000, C257SE21599
Reexamination Certificate
active
07662668
ABSTRACT:
A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element.
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Asai Makoto
Fujii Tetsuo
Sugiura Kazuhiko
Tamura Muneo
Yokoyama Kenichi
DENSO CORPORATION
Nguyen Khiem D
Posz Law Group , PLC
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