Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2005-05-17
2005-05-17
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S459000
Reexamination Certificate
active
06893942
ABSTRACT:
A method for separating a mask from the surface of a semiconductor wafer comprises first mounting a mask/wafer combination on a rotatable surface and then rotating the rotatable surface. A separating device is inserted at the edge of the mask between the two mating services of the mask and the semiconductor wafer. The semiconductor device is then urged upward toward the rotating center of the mask/wafer combination while the rotatable surface is rotating.
REFERENCES:
patent: 6117778 (2000-09-01), Jones et al.
Molina, II Michael Anthony
Molina, Sr. Michael (Miguel) Anthony
Ojeda, Sr. Joseph Albert
Hi-Tech Products, Inc.
Howison & Arnott , L.L.P.
Le Dung A.
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