Method for separating a film and a substrate

Details Method for separating a film and a substrate Method for separating a film and a substrate

2005-12-13

2005-12-13

Osele, Mark A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S345420, C156S583200, C438S458000

Reexamination Certificate

active

06974521

ABSTRACT:
A method for separating a film and a substrate, the method comprising the following stops: a) on the film at least a part of a foil is provided, whereby an adhesive contact between the film and the foil is effected; b) the foil and the film being in adhesive contact therewith are bent away from the substrate; and c) the film is uninterruptedly separated from the substrate, characterized in that at least a part of the foil is attached to a circumferential surface of a roller, which circumferential surface virtually touches the substrate, and wherein during step b) the substrate with the film, relative relative to the roller, is fed to the roller, while the roller is rotated such that during step c) and increasing part of the film is bent around the circumferential surface, while an increasing part of the substrate from which the film has been separated is led, relative to the roller, away from the roller.

REFERENCES:
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patent: 5376210 (1994-12-01), Brochu et al.
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patent: 5743990 (1998-04-01), Iwami et al.
patent: 6500298 (2002-12-01), Wright et al.
patent: 6681829 (2004-01-01), Baccini
patent: 26 34 413 (1977-02-01), None
patent: 27 47 265 (1979-04-01), None
patent: 1 069 602 (2001-01-01), None
Patent Abstracts of Japan, vol. 018, No. 091 (E-1508), Feb. 15, 1994 & JP 05 299362 A (Sumitomo Electric Ind Ltd), Nov. 12, 1993 abstract.

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