Method for self-assembling microstructures

Details Method for self-assembling microstructures Method for self-assembling microstructures

2011-05-17

2011-05-17

Norton, Nadine G (Department: 1713)

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

C216S037000, C216S041000, C427S184000, C427S255140, C427S319000

Reexamination Certificate

active

07943052

ABSTRACT:
A method for self-assembling a plurality of microstructures onto a substrate comprising using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and further permanently fixed on and electrical connection with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the present method. The present method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.

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Heiko Jacobs et al. Science, vol. 296, (2002), pp. 323-325.
Science: vol. 296, No. 5566, pp. 323-325 Apr. 12, 2002.

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