Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-05-29
2010-10-05
Arbes, Carl J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S832000, C029S842000, C438S106000, C438S110000, C438S127000
Reexamination Certificate
active
07805835
ABSTRACT:
A method for selectively processing a surface tension of a solder mask layer in a circuit board is provided. The method conducts surface tension processing to the flip-chip area and the non-flip-chip area of the solder mask layer in the circuit board. Therefore, the underfill used in packaging configures relative contact angles at the flip-chip area and the non-flip-chip area of the solder mask layer, respectively. In such a way, the present invention is adapted to solve the difficulties of the underfill void bulb and the overflowing contamination at the same time.
REFERENCES:
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5766674 (1998-06-01), Hirosawa
patent: 5825629 (1998-10-01), Hoebener et al.
patent: 6794225 (2004-09-01), Manepalli et al.
patent: 2003/0189243 (2003-10-01), Jiang et al.
patent: 2004/0121512 (2004-06-01), Manepalli et al.
patent: 2005/0195582 (2005-09-01), Landeros et al.
patent: 2007/0152024 (2007-07-01), Pang et al.
Chang Jen-Fang
Dai Hsien-Ming
Hsu Jun-Chung
Arbes Carl J
Kinsus Interconnect Technology Corp.
LandOfFree
Method for selectively processing surface tension of solder... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for selectively processing surface tension of solder..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for selectively processing surface tension of solder... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4183046