Method for selectively plating an organic substrate

Details Method for selectively plating an organic substrate Method for selectively plating an organic substrate

1996-11-08

1998-07-14

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 20, 216 41, 216 56, 205125, 205135, 205927, B44C 122

Patent

active

057799210

ABSTRACT:
The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses

REFERENCES:
patent: 2699425 (1955-01-01), Nieter
patent: 3053929 (1962-09-01), Friedman
patent: 3801427 (1974-04-01), Morishita et al.
patent: 3953566 (1976-04-01), Gore
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4705762 (1987-11-01), Ota
patent: 4985296 (1991-01-01), Mortimer, Jr.

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