Method for selectively electroplating apertured metal or metalli

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing

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204485, 204486, 204488, 204499, 204507, 204512, 205 96, 205122, 205128, 205129, 430315, 430319, C25D 502, C25D 1312

Patent

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057025835

ABSTRACT:
The invention relates to a method and an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

REFERENCES:
patent: 3471389 (1969-10-01), Swanson
patent: 3879277 (1975-04-01), Guzzetta et al.
patent: 4568438 (1986-02-01), Lauke
patent: 4600491 (1986-07-01), Urquhart
patent: 4844783 (1989-07-01), Takahashi et al.
patent: 5183724 (1993-02-01), Johnson
patent: 5194139 (1993-03-01), Kinase et al.

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