Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate
2005-12-06
2005-12-06
Blum, David S. (Department: 2813)
Semiconductor device manufacturing: process
Chemical etching
C438S700000, C438S712000
Reexamination Certificate
active
06972258
ABSTRACT:
A method for selectively etching a semiconductor feature opening to controllably achieve a critical dimension accuracy including providing a semiconductor wafer including a first opening formed extending through a thickness of at least one dielectric insulating layer and having an uppermost inorganic BARC layer; depositing a photoresist layer over the uppermost BARC layer and patterning the photoresist layer to form an etching pattern for etching a second opening overlying and encompassing the first opening; carrying out a first plasma assisted etching process to etch through a thickness of the BARC layer including a predetermined amount of CO in a plasma etching chemistry to increase an etching resistance of the photoresist layer; and, carrying out a second plasma assisted etching process to etch through a thickness portion of the at least one dielectric insulating layer to form the second opening.
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Chen Hung-Ming
Chu Yin-Shen
Blum David S.
Taiwan Semiconductor Manufacturing Co. Ltd.
Tung Randy W.
Tung & Associates
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