Method for selectively bonding substrate having fine electrocond

Details Method for selectively bonding substrate having fine electrocond Method for selectively bonding substrate having fine electrocond

1985-12-12

1987-06-30

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

204 15, C25D 1500, B32B 3112

Patent

active

046768548

ABSTRACT:
A method for selectively bonding a substrate having an electroconductive pattern to another substrate at selected portions of the pattern. An adhesive layer is formed on the selected portion of the pattern by the electrodeposition of a high molecular resin and the substrate is then bonded to the other substrate by means of the adhesive layer.

REFERENCES:
patent: 4127699 (1978-11-01), Aumiller et al.

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