Method for selective removal of copper contaminants from activat

Details Method for selective removal of copper contaminants from activat Method for selective removal of copper contaminants from activat

1980-10-27

1981-12-08

Andrews, R. L.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204106, C25C 112

Patent

active

043046460

ABSTRACT:
A method is provided for selective removal of copper contaminants from aqueous activator solutions which also contain palladium and tin. It comprises placement of insoluble electrodes in the aqeuous solution and application of a low voltage, preferably ranging from between 0.05 to 5.0 volts across the electrodes, whereby metallic copper is selectively deposited upon the cathode, with palladium and tin remaining in the aqueous solutions. Typically, the soluble copper ions are present as contaminants in activator solutions utilized in various electroless metal plating processes.

REFERENCES:
patent: 556092 (1896-03-01), Frolich
patent: 3751355 (1973-08-01), Mandroian

Affiliated with

Also associated with

Rating

Method for selective removal of copper contaminants from activat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for selective removal of copper contaminants from activat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for selective removal of copper contaminants from activat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-566740