Method for selective plating

Details Method for selective plating Method for selective plating

1976-06-14

1977-07-05

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204224R, 204275, C25D 502, C25D 508, C25D 1728

Patent

active

040338320

ABSTRACT:
An electro-plating method and apparatus therefor in which a discrete area of plating, such as a stripe about an elongated workpiece can be deposited without the use of separate masking. A plating solution having a depth equal to the length of the stripe desired is floated over a denser, inert, immiscible liquid (such as a liquid fluorocarbon). Workpieces are attached to a carrier which is electrically energized as cathodes and which are positioned vertically such that the area to receive the plated stripe is within the layer of plating solution, the workpieces projecting above the plating solution layer and below into the inert liquid as necessary. Pump weir and sump arrangements provide for maintenance of the plating solution and inert liquid levels and an anode is separately provided.

REFERENCES:
patent: 3254004 (1966-05-01), Jackson et al.
patent: 3388047 (1968-06-01), Higgins
patent: 3657097 (1972-04-01), Baldock et al.

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