Method for selective formation of silicide films without formati

Fishing – trapping – and vermin destroying

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437193, 437201, 20419217, H01L 2128

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active

055653839

ABSTRACT:
In a method for forming silicide films on a silicon substrate being formed thereon with a gate surrounded by gate side walls and being formed therein with diffusion regions, the silicide film being formed on a predetermined region of the silicon substrate at least except for an extremely thin film on the gate side walls. The method comprises the following steps. The silicon substrate is subjected to a collimated sputtering of metal atoms with use of a meshed mask on the silicon substrate surface to deposit a metal film on an entire surface of the silicon substrate, except for an extremely thin film on the vertical walls. The deposited metal film is further subjected to a heat treatment to react the metal film with the diffusion regions to thereby selectively form a metal silicide film at least on the diffusion regions, except for an extremely thin film on the vertical walls.

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patent: 5401675 (1995-03-01), Lee et al.
patent: 5426330 (1995-06-01), Joshi et al.
S. Wolf, "Silicon Processing for the VLSI Era, vol. 2: Process Integration", pp. 144, 145, 147, 148, Lattice Press, (1990).

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