Method for selective encapsulation

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427259, 427273, B05D 132

Patent

active

040597083

ABSTRACT:
Disclosed is a method for encapsulating selected areas of solid state integrated circuits. The areas which are to remain uncoated are covered with a water and/or alcohol soluble polymer of sufficient viscosity to form stable droplets. The encapsulant is then applied, usually by flow coating, and cured. The polymer mask is removed by applying a material such as water or alcohol which does not affect the encapsulant. The method thus allows relatively small areas to be masked without any significant residue left on the circuit.

REFERENCES:
patent: 3343048 (1967-09-01), Kuehn
patent: 3597269 (1971-08-01), Chang
patent: 3928661 (1975-12-01), Higbee
patent: 3935334 (1976-01-01), Narui

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