Method for selective electroless plating of copper onto a non-co

Details Method for selective electroless plating of copper onto a non-co Method for selective electroless plating of copper onto a non-co

1983-10-11

1984-05-15

Powell, William A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

156630, 156656, 156666, 156902, 427282, 427304, 427307, 427322, 430313, 430315, B05D 512, B05D 132, B05D 304, C23F 100

Patent

active

044488041

ABSTRACT:
Multistep process for electroless plating of copper onto a non-conductive surface including the steps of: (1) laminating a rough copper sheet onto the non-conductive surface; (2) etching away all the copper; (3) conditioning the surface with multifunctional positively charged molecules derived from copolymers of polyacrylamide and functionally active tetraalkylammonium compounds in an diluted inorganic acid; (4) activating the conditioned surface preferably with stannous/palladium chloride particles; (5) treating the activated surface with deionized water and diluted HCl; (6) applying a photoresist layer to the surface and selectively exposing and developing the photoresist to produce a mask corresponding to the negative of the desired circuit pattern; and (7) plating copper using successively two baths differing in their oxygen and CN.sup.- concentration, where the foregoing steps are interspersed with washing steps.

REFERENCES:
patent: 3846168 (1974-11-01), Elmore
patent: 3978252 (1976-08-01), Lombardo et al.

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