Method for selecting a substrate intended for use in a cutting o

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156248, 156250, 156268, 73788, 73827, B32B 3114, B32B 3118, G01N 300, G01N 308

Patent

active

059617667

ABSTRACT:
This invention relates to a method for selecting a substrate intended for use in a cutting operation. The method is particularly suitable for selecting facestock materials intended for use in making pressure-sensitive adhesive (PSA) constructions such as PSA labels. The method includes the following steps (A)-(D). Step (A) involves cutting the substrate during a first cutting step to form at least two shapes in the substrate. The shapes are positioned in spaced relationship to each other. A matrix is formed during this cutting step. The matrix is the waste substrate material around the shapes. Step (B) involves cutting the substrate with a second cutting step to form a test sample. The test sample is comprised of part of one shape, part of the next adjacent shape, and the matrix around the shape parts. Step (C) involves separating the matrix from the shape parts while measuring the force required to separate the matrix from the shape parts and measuring the displacement of the separating force. Step (D) involves determining the friction energy required to separate the matrix from the shape parts. The selection of the substrate is dependent on the friction energy.

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http://www.stablemicrosystems.com/ pp. 1,4-8, 11,27-28 of enclosure, 1996.
Chuang et al., Adhesive Age, Sep. 1997, pp. 18-23, "Avery Adhesive Test Yields More Performance Data Than Traditional Probe".

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