Method for securing a hybrid circuit on a printed circuit board

Details Method for securing a hybrid circuit on a printed circuit board Method for securing a hybrid circuit on a printed circuit board

1994-02-09

1996-04-23

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228190, 228254, B23K 3102

Patent

active

055095992

ABSTRACT:
Hybrid circuits are usually secured with contact pins (combs) on printed circuit boards by undergoing a flow solder bath. Further, surface-mountable components are soldered on the printed circuit board in a furnace. Two soldering processes are necessary for this purpose. The method of the invention avoids one of the soldering processes by applying through-contacted bores on the carrier substrate of the hybrid circuit. These through-contacted bores are put in place onto solder surfaces of the printed circuit board having a paste solder and the overall arrangement is soldered in a furnace.

REFERENCES:
patent: 3318993 (1967-05-01), Beelitz
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4373259 (1983-02-01), Motsch
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 5048747 (1991-09-01), Clark et al.
patent: 5383093 (1995-01-01), Nagasaka
Japanese Abstract, S. Naoharu, "Hybrid Integrated Circuit Device", vol. 14, No. 190 (E-0918), JP2037761, Jul. 2, 1990.
Japanese Abstract, T. Eiichi, "Hybrid Circuit Board", vol. 13, No. 568 (E-861), JP1236686, Sep. 21, 1989.

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