Method for sealingly molding semiconductor electronic components

Details Method for sealingly molding semiconductor electronic components Method for sealingly molding semiconductor electronic components

1990-02-20

1991-12-10

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Flash or sprue removal type

264138, 26427214, 26427217, B29C 4514, B29C 3702

Patent

active

050716123

ABSTRACT:
A molding apparatus for sealingly molding semiconductor electronic components is provided which includes a pair of molding body halves having cavities each holding a corresponding semiconductor electronic component on the upper surface portion of at least one molding body halves, a corresponding gate communicating at one open end with the associated pair of cavities to allow a thermosetting resin to flow into the respective cavity so that a semiconductor electronic component is obtained as a finished product at the location of the cavity, and a groove which, upon placing a lead frame on the upper surface of the molding body half, faces an unnecessary lead. The groove is coupled at one open end to the associated cavities and at the other open end to an outer air. Upon the molding of the semiconductor electronic component as a finished product, air and/or any extra thermosetting resin can be discharged from the associated cavity into the outer atmosphere via the aforementioned groove. Some resin, deposited on the groove, can be removed, together with the unnecessary lead, from the rest of the finished product.

REFERENCES:
patent: 4032963 (1977-06-01), Thome
patent: 4188708 (1980-02-01), Frederiksen
patent: 4862586 (1989-09-01), Osada

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