Method for sealing packages

Details Method for sealing packages Method for sealing packages

1973-05-24

1976-02-10

Shore, Ronald J.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228 46, 29588, 156498, 53 39, B23K 3100

Patent

active

039373886

ABSTRACT:
A method and apparatus for sealing packages, e.g., microelectronics packages containing heat sensitive elements, by applying heat to melt solder on the peripheries thereof. At the same time heat is being applied to a package heat sinks are simultaneously engaged with the top and bottom portions thereof to carry off excess heat and thus protect the heat sensitive elements from damage.

REFERENCES:
patent: 2289618 (1942-07-01), Young
patent: 2393198 (1946-01-01), Somerville
patent: 2928200 (1960-03-01), Kannergiesser et al.
patent: 3102182 (1963-08-01), Oelze et al.
patent: 3382342 (1968-05-01), Dix et al.
patent: 3383454 (1968-05-01), Dix
patent: 3476986 (1969-11-01), Tsuji
patent: 3522135 (1970-07-01), Page
patent: 3552630 (1971-01-01), Dean
patent: 3583063 (1971-06-01), Growney
patent: 3683146 (1972-08-01), Nugent et al.

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