Method for sealing integrated circuit components with heat recov

Details Method for sealing integrated circuit components with heat recov Method for sealing integrated circuit components with heat recov

1974-04-30

1978-11-21

Askin, Laramie E.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29447, 29588, 220201, 220305, 357 74, H05K 506, H05K 503, B23P 1102

Patent

active

041267583

ABSTRACT:
A method of sealing electrical components by positioning over the electrical component a heat recoverable sealing member. When a metal sealing member is utilized, the metal is in a deformed, unstable martensitic state, and thereafter is allowed to heat recover to a stable, austenitic state. When a plastic material is used, the polymer is heated, deformed and quenched in an unstable state, so upon heating it recovers via its elastic memory to a stable state.

REFERENCES:
patent: 1058210 (1913-04-01), Welch
patent: 1981334 (1934-11-01), Schmalz
patent: 3174620 (1965-03-01), Edgarton
patent: 3714370 (1973-01-01), Nixen et al.

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