Method for sealing capsules

Details Method for sealing capsules Method for sealing capsules

1983-05-23

1989-04-11

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

53900, 1562748, 156294, 156305, 206528, 206530, 428916, B65B 728

Patent

active

048203645

ABSTRACT:
The present invention relates to a method for sealing capsules to render them both tamper-proof and tamper-evident. The method comprises locating a quantity of an adhesion-promoting fluid between the adjacent surfaces of the overlapping capsule wall, and thereafter applying dielectric heat energy in the vicinity of the adhesion-promoting fluid, to cause the adjacent surfaces of the capsule walls to form a permanent bond. Preferably, the adhesion-promoting fluid may comprise a non-solvent for the capsule walls that further has a high dielectric constant. Suitable adhesion-promoting fluids include lower alkanols. The method is capble of rapid operation and is inexpensive by virtue of its simplicity. Reliable capsule seals are achieved that are incapable of violation.

REFERENCES:
patent: 3071513 (1963-01-01), De Boer et al.
patent: 3164508 (1965-01-01), Marcey

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