Method for sealing an electronic device containing a fluid mater

Details Method for sealing an electronic device containing a fluid mater Method for sealing an electronic device containing a fluid mater

1989-09-21

1991-04-16

Hoag, Willard

Plastic and nonmetallic article shaping or treating: processes

Encapsulating normally liquid material

15624417, 1563031, 1563082, 264 22, 264 25, 264249, 264261, B29C 3938, B29C 3910

Patent

active

050080490

ABSTRACT:
A device containing a fluid material is sealed by sealant material placed essentially completely around the periphery of the device to join spaced apart first and second members of the device; and aperture is formed through the seal and the device interior is evacuated. Then fluid material is introduced into the device interior through the aperture and only a limited region of the device, confined substantially to the aperture is exposed to electromagnetic radiation from a laser or the like, to hermetically close the aperture when a photoreactive adhesive is injected into the aperture to cause the adhesive to solidify when contacted by the electromagnetic radiation. In an alternate embodiment, the aperture is filled with a plug of thermoplastic material, which is then selectively heat treated by a laser or the like to cause the plug to bind to the aperture boundary and hermetically enclose the fluid material.

REFERENCES:
patent: 2330497 (1943-09-01), Larmour
patent: 3953932 (1976-05-01), Graves
patent: 3967882 (1976-07-01), Kubota et al.
patent: 4226509 (1980-10-01), Jacobs
patent: 4390245 (1983-06-01), Shimizu et al.
patent: 4482511 (1984-11-01), Komatsubara
patent: 4494825 (1985-01-01), Sasaki et al.
patent: 4610510 (1986-09-01), Funada et al.
patent: 4640583 (1987-02-01), Hoshikawa et al.
patent: 4752498 (1988-06-01), Fudim
patent: 4820025 (1989-04-01), Nakanowatari
Edmonds et al., "Liquid Crystal Cell Filling", IBM Technical Disclosure Bull., vol. 16, No. 2, Jul. 1973.

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