Method for sealedly forming envelope

Details Method for sealedly forming envelope Method for sealedly forming envelope

1995-07-06

1997-12-02

Czaja, Donald E.

Glass manufacturing

Processes

Fusion bonding of glass to a formed part

65 40, 65 58, C03C 2704, C03C 2712

Patent

active

056931115

ABSTRACT:
A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.

REFERENCES:
patent: Re25791 (1965-06-01), Claypoole
patent: 3217088 (1965-11-01), Steierman
patent: 3486871 (1969-12-01), Martin
patent: 3503763 (1970-03-01), Mills
patent: 4131445 (1978-12-01), Klockenga
patent: 4132539 (1979-01-01), Jeffries
patent: 4564932 (1986-01-01), Lange
patent: 5009689 (1991-04-01), Haisma et al.
patent: 5021074 (1991-06-01), Kavacik et al.

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