Method for seal molding electronic components with resin

Details Method for seal molding electronic components with resin Method for seal molding electronic components with resin

1989-12-13

1993-04-06

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

With step of cleaning, polishing, or preconditioning...

26427211, 264313, 425227, B28B 304, B29C 3372

Patent

active

052001253

ABSTRACT:
An electronic component is molded into a resin seal by first compressing a resin tablet to increase its density by removing air contained in the tablet. The compressed or molded resin tablet is supplied into a pot (3) wherein the tablet is melted by heat. The melted resin is injected under pressure into cavities (5a, 5b) through a transfer path (9), whereby electronic components (10) set in these cavities (5a, 5b) are seal molded. This method substantially prevents air from being mixed into the melted resin and also avoids the formation of a void within and on the surface of a resin sealed molding of the electronic components (10) encapsulated in the resin.

REFERENCES:
patent: 3712785 (1973-01-01), Hirt et al.
patent: 3969461 (1976-07-01), Boesch et al.
patent: 4569814 (1986-02-01), Chang et al.
patent: 4599215 (1986-07-01), Smarsly et al.
patent: 4653993 (1987-03-01), Boschman
patent: 4654178 (1987-03-01), Aritomi et al.
patent: 4761264 (1988-08-01), Nishio et al.
patent: 4820463 (1989-04-01), Raufast
patent: 4826931 (1989-05-01), Sakai et al.
patent: 4853170 (1989-08-01), Buhler et al.

Affiliated with

Also associated with

Rating

Method for seal molding electronic components with resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for seal molding electronic components with resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for seal molding electronic components with resin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-534359