Method for screen printing solder paste onto a substrate with de

Details Method for screen printing solder paste onto a substrate with de Method for screen printing solder paste onto a substrate with de

1986-11-28

1988-11-15

Beck, Shrive

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228187, 427 96, 427 58, 427282, B23K 3102

Patent

active

047843101

ABSTRACT:
A printing screen for screen printing fabrication substances such as solder paste has an aperture formed therein so that the screen may be placed on a substrate surface with a pre-mounted device extending through the aperture. A metal cap is bonded to the screen over the pre-mounted device to protect the device against damage during a subsequent screen printing operation. Different elements may, therefore, be bonded to a substrate in completely independent steps without the need for fluxing operations in later bonding operations.

REFERENCES:
patent: 3680196 (1972-08-01), Leinkram
patent: 3707762 (1973-01-01), Bochinski
patent: 3879837 (1975-04-01), Mizwkoshi
patent: 4269870 (1981-05-01), Boynton
patent: 4324815 (1982-04-01), Mitami
patent: 4371912 (1983-02-01), Guzik
patent: 4454646 (1984-06-01), Joy
patent: 4678531 (1987-07-01), Metzger
Balents, L. M., "A Metal Mask . . . Thereon," RCA TN No. 978, Sep. 1974, pp. 1-2, Classified in 427/96.

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