Stone working – Splitting – shearing – and punching
Patent
1999-03-17
1999-12-28
Hachuba, M.
Stone working
Splitting, shearing, and punching
83495, 835081, 83864, 83883, 83 39, 125 20, 125 1301, 438113, B26D 300, H01L 21328, B28D 132
Patent
active
06006739&
ABSTRACT:
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
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Akram Salman
Gochnour Derek J.
Hembree David R.
Hess Michael E.
Hachuba M.
Micro)n Technology, Inc.
Pryor Sean
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