Method for sawing wafers employing multiple indexing...

Details Method for sawing wafers employing multiple indexing... Method for sawing wafers employing multiple indexing...

2005-08-23

2005-08-23

Rachuba, M. (Department: 3723)

Stone working

Splitting, shearing, and punching

C125S013010, C125S020000

Reexamination Certificate

active

06932077

ABSTRACT:
A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

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