Method for sawing wafers employing multiple indexing...

Details Method for sawing wafers employing multiple indexing... Method for sawing wafers employing multiple indexing...

2005-05-24

2005-05-24

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Miscellaneous

C257S048000, C257S202000, C257S203000, C257S499000, C257S679000, C438S019000, C438S460000, C438S461000, C438S462000, C438S463000, C438S464000, C438S465000

Reexamination Certificate

active

06897571

ABSTRACT:
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers including a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

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