Compositions – Etching or brightening compositions
Reexamination Certificate
2008-04-01
2008-04-01
Chen, Kin-Chan (Department: 1765)
Compositions
Etching or brightening compositions
C427S123000
Reexamination Certificate
active
09479089
ABSTRACT:
The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.
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Bernards Roger
Gonzalez Hector
Kucera Al
Schanhaar Mike
Chen Kin-Chan
Electrochemicals Inc.
McAndrews Held & Malloy Ltd.
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