Etching a substrate: processes – Nongaseous phase etching of substrate – Substrate is multilayered
Reexamination Certificate
2006-12-26
2006-12-26
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Nongaseous phase etching of substrate
Substrate is multilayered
C216S013000, C216S100000, C216S106000, C252S079100
Reexamination Certificate
active
07153445
ABSTRACT:
The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.
REFERENCES:
patent: 3756957 (1973-09-01), Shiga
patent: 4512818 (1985-04-01), Valayil et al.
patent: 5073456 (1991-12-01), Palladino
patent: 5532094 (1996-07-01), Arimura et al.
patent: 5800859 (1998-09-01), Price et al.
patent: 5861076 (1999-01-01), Adlam et al.
patent: 5869130 (1999-02-01), Ferrier
patent: 5910255 (1999-06-01), Noddin
patent: 5931996 (1999-08-01), Reisser et al.
patent: 5985998 (1999-11-01), Sommerfeld et al.
patent: 6054061 (2000-04-01), Bayes et al.
patent: 6106899 (2000-08-01), Nakagawa et al.
patent: 6136502 (2000-10-01), Satoshi et al.
patent: 6146701 (2000-11-01), Ferrier
patent: 6162503 (2000-12-01), Ferrier
patent: 6261466 (2001-07-01), Bayes et al.
patent: 6284309 (2001-09-01), Bishop et al.
patent: 6383272 (2002-05-01), Ferrier
patent: 6521139 (2003-02-01), Kondo et al.
patent: 6544436 (2003-04-01), Morikawa et al.
patent: 6666987 (2003-12-01), Morikawa et al.
patent: 2001/0000884 (2001-05-01), Miller et al.
patent: 2002/0038790 (2002-04-01), Kurii et al.
patent: 11-029883 (1999-02-01), None
patent: WO 98/19217 (1998-05-01), None
patent: WO 99/40764 (1999-08-01), None
patent: WO 99/40765 (1999-08-01), None
patent: WO 01/29289 (2001-04-01), None
patent: WO 01/29290 (2001-04-01), None
patent: WO 01/49805 (2002-07-01), None
Bernards Roger
Gonzalez Hector
Kucera Al
Schanhaar Mike
Ahmed Shamim
Electrochemicals Inc.
McAndrews Held & Malloy Ltd.
LandOfFree
Method for roughening copper surfaces for bonding to substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for roughening copper surfaces for bonding to substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for roughening copper surfaces for bonding to substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3690874