Method for roughening copper surface

Details Method for roughening copper surface Method for roughening copper surface

2005-06-07

2005-06-07

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

C134S003000, C134S041000, C216S096000, C216S100000, C216S105000, C216S106000, C216S107000, C216S108000, C216S109000, C252S079100, C252S079200, C252S079300, C252S079400, C510S367000, C510S375000

Reexamination Certificate

active

06902626

ABSTRACT:
A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.

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