Method for roughening ceramic substrate surface and method for m

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 96, 4274431, 427305, B05D 512

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048658774

ABSTRACT:
A method for roughening a ceramic substrate surface includes a step of sequentially taking out part of roughening a treatment bath of phosphoric acid into which the ceramic substrate is dipped prior to a formation on the substrate of conductor a layer, and subjecting the part of the bath taken out sequentially to regeneration treatment. Any increase in the viscosity due to dehydrating condensation of the roughening bath can be thereby effectively restrained to prolong effective life of the bath. Further, the surface roughened ceramic substrate can be provided thereon with conductor layers smoothly formed by means of a plating and eventually with a circuit pattern as well as a resistor formed on the pattern within an inert gas atmosphere.

REFERENCES:
patent: 3296012 (1967-01-01), Stalencker
patent: 4104421 (1978-08-01), Maher
patent: 4316920 (1982-02-01), Brown
patent: 4448804 (1984-05-01), Amelio
patent: 4563217 (1986-01-01), Kikuchi
patent: 4574094 (1986-03-01), DeLuca et al.
patent: 4604229 (1986-08-01), DeLuca et al.
patent: 4666744 (1987-05-01), DeLuca
patent: 4684512 (1987-08-01), Stewart
patent: 4696851 (1987-09-01), Pryor
Warren L. McCabe and Julian C. Smith "Unit Operations of Chemical Engineering" McGraw-Hill, 2nd ed., 1967, p. 540.
Chemical Abstract 105:196165 vol. 105, 1986, p. 323.

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