Method for rinsing, cleaning and drying silicon wafers

Details Method for rinsing, cleaning and drying silicon wafers Method for rinsing, cleaning and drying silicon wafers

1987-09-09

1990-02-20

Pal, Asok

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 251, 134 254, 134 64R, 134135, 134137, 134140, B08B 310

Patent

active

049023500

ABSTRACT:
Apparatus and method for cleaning, rinsing and drying thin wafers such as silicon wafers or other disc-like substrates or elements wherein the wafers are rinsed in a hot water bath while supported in a conventional slotted carrier. The wafers are cleaned and rinsed while being moved through a planar beam of sonic energy in a water bath. Drying of the wafers is achieved by slowly raising the wafers out of the water bath such that the water surface tension at the surface of the water bath evenly and effectively draws off water from the rinsing surfaces of the wafers. A novel lift mechanism is provided for moving the wafers through the beam of sonic energy in the water bath and for slowly lifting the wafers and the cassette in independent movements through the surface of the water such that there is no contact between the wafers and the cassette or between the cassette and any other object at the point where the cassette and wafers move through the surface of the water.

REFERENCES:
patent: 4079522 (1978-03-01), Ham
patent: 4132567 (1979-01-01), Blackwood
patent: 4318749 (1982-03-01), Mayer
patent: 4458703 (1984-07-01), Inoue et al.
patent: 4537511 (1985-08-01), Frei
patent: 4543130 (1985-09-01), Shwartzman
patent: 4722752 (1988-02-01), Steck

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