Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Removing surface portion of composite workpiece to expose...
Patent
1995-06-26
1999-07-20
Silbaugh, Jan H.
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Removing surface portion of composite workpiece to expose...
264138, 264230, 264DIG4, 264DIG66, 264295, 264296, 264313, 264322, B32B 3100, B29C 4100, B29C 3702, B28B 730
Patent
active
059252987
ABSTRACT:
A method and apparatus for forming a rigid circuit board has a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has a clamping member and a stationary member. The clamping member uses a shape memory alloy actuator with a transition temperature about the same as the glass transition temperature of the laminate. The actuator is used to form the bend region to a predetermined shape around the stationary member. When the circuit board is cooled, the circuit board again becomes rigid in its predetermined shape.
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Belke, Jr. Robert Edward
Todd Michael George
Walles Bethany Joy
Ford Motor Company
Gray Robin S.
Malleck Joseph W.
Silbaugh Jan H.
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