Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate
2005-03-15
2005-03-15
Tran, Thien F. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
C438S113000, C438S458000, C438S462000
Reexamination Certificate
active
06867479
ABSTRACT:
A method for rewiring contact pads in the wafer-level package is inventively provided. In order to be able to make the terminals of the characterization pads available for testing in a wafer-level package without these terminals being available later to the end user, the invention provides that the rewiring line is led via the scribe line of the wafer.
REFERENCES:
patent: 5696404 (1997-12-01), Murari et al.
patent: 5923047 (1999-07-01), Chia et al.
patent: 06 151 535 (1994-05-01), None
patent: 10 050 780 (1998-02-01), None
patent: 10 125 745 (1998-05-01), None
patent: 11 330 176 (1999-11-01), None
Greenberg Laurence A.
Infineon - Technologies AG
Mayback Gregory L.
Stemer Werner H.
Tran Thien F.
LandOfFree
Method for rewiring pads in a wafer-level package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for rewiring pads in a wafer-level package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for rewiring pads in a wafer-level package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3427514