Method for reticulating perforated sheets

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

156252, 156253, 156285, 1563096, 156330, 156356, 156497, 264504, B32B 3112, B32B 3126

Patent

active

049902016

ABSTRACT:
A novel method is provided for reticulating adhesive-backed, perforated substrates. The method entails tacking a continuous sheet of viscous reticulating adhesive to one side of the substrate and then contacting the other side with heated air. The temperature of the air is regulated such that the adhesive softens and bubbles over the perforations but final cure is not initiated. The air is directed at a velocity such that the bubbles burst and the adhesive is redeposited onto the adhesive-side of the substrate.

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