Method for resin encapsulation of a semiconductor device and a r

Details Method for resin encapsulation of a semiconductor device and a r Method for resin encapsulation of a semiconductor device and a r

1983-01-19

1988-09-20

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524493, 423337, C08K 336

Patent

active

047726440

ABSTRACT:
While high-performance semiconductor devices encapsulated with a resin composition are subject to the problem of wrong operation due to the alpha-particles emitted from the trace amounts of radioactive impurities, e.g. uranium and thorium, contained in the silica filler incorporated in the resin composition, a means for solving this problem is provided by use of a silicon dioxide powder obtained by the pyrolysis of a volatilizable silicon compound free from radioactive impurities in an oxidizing condition and having an average particle diameter in the range from 0.5 to 100 .mu.m in place of the conventional silica fillers.

REFERENCES:
patent: 4070330 (1978-01-01), Rawlings
patent: 4118595 (1978-10-01), Pfahnl et al.
patent: 4200445 (1980-04-01), Bihuniak et al.
patent: 4292268 (1981-09-01), Salensky
patent: 4293479 (1981-10-01), Hanada et al.
Katz et al.; Handbook of Fillers and Reinforcements for Plastics: Van Nostrand Reinhold Co.; 1978; pp. 137-139.

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