Coating processes – Measuring – testing – or indicating – Thickness or uniformity of thickness determined
Patent
1981-02-05
1982-05-25
Hoffman, James R.
Coating processes
Measuring, testing, or indicating
Thickness or uniformity of thickness determined
204192C, 427 91, C23C 1302, C23C 1500
Patent
active
043317022
ABSTRACT:
Reproducible manufacture of metallic layers for semiconductor and thin film technology is attained by dynamic control of the layering process whereby the specific electrical resistance, .rho., is determined as a function of layer thickness, d, and layering parameters are regulated by a process-control computer. With this process, factors effecting the growth of a layer with respect to its structure, texture and composition are identified and calculated as measured values of .rho. and d, by the process-control computer and corrections for individual layering parameters are calculated via a suitable control program. In this manner, the nucleation of a layer and its growth is influenced in such a manner that the layer exhibits the desired electrical, structural and texture properties in its final state.
REFERENCES:
K. Fuchs et al, "The Conductivity of Thin Metallic Films According to the Electron Theory of Metals", Proc. Cambridge Phil. Soc. vol. 34, (1938), pp. 100-108.
E. H. Sondheimer, "The Mean Free Path of Electrons in Metals", Advances In Physics, vol. 1, No. 1 (1952) pp. 1-42.
Y. Namba, "Resistivity and Temperature Coefficient of Thin Metal Films with Rough Surfaces", Japanese Journal of Applied Physics, vol. 9, No. 11 (1970), pp. 1326-1329.
Hieber Konrad
Mayer Norbert
Hoffman James R.
Siemens Aktiengesellschaft
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