Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Patent
1998-01-22
2000-07-11
Bowers, Charles
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Electrical characteristic sensed
438 4, 438758, 438761, 438773, B24B 100
Patent
active
060871911
ABSTRACT:
A method for repairing defects in a surface layer of a substrate. The method comprises the redeposition, in a solvent environment, of a fill material into the defects of the surface layer. The fill material is provided by the surface layer itself or from a separate source comprising a different material from that of the surface layer.
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Anderson Jay H.
Bowers Charles
International Business Machines - Corporation
Kilday Lisa
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