Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-10-24
2008-12-09
Kim, Paul D (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S417000, C029S603060, C029S603150, C204S192340, C204S192100, C360S230000, C360S237100, C438S455000, C438S458000, C438S946000, C451S005000, C451S041000
Reexamination Certificate
active
07461446
ABSTRACT:
A method is presented for repairing damaged photomasks for electronic component fabrication processes, particularly for fabrication of the ABS of a disk drive slider. The method includes applying an overcoat of material having index of fraction which is close to the index of refraction of the photoresist material of the damaged photomask to produce a non-scattering boundary surface. The overcoat material preferably includes an overcoat base material which is a polymer having an index of refraction which is in the range of plus or minus 0.1 from the index of refraction of said photoresist material.
REFERENCES:
patent: 5597677 (1997-01-01), Kangas et al.
patent: 5982545 (1999-11-01), Su
patent: 6727047 (2004-04-01), Montgomery et al.
patent: 6852421 (2005-02-01), Wayton et al.
patent: 6884735 (2005-04-01), Okoroanyanwu et al.
patent: 7319224 (2008-01-01), Park et al.
patent: 2002/0102500 (2002-08-01), Hung et al.
patent: 2005/0042554 (2005-02-01), Dierichs et al.
McKean Dennis Richard
Suzuki Gary John
Guernsey Larry B.
Hitachi Global Storage Technologies - Netherlands B.V.
Kim Paul D
Patent Law Office of Larry Guernsey
LandOfFree
Method for repairing photoresist layer defects using index... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for repairing photoresist layer defects using index..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for repairing photoresist layer defects using index... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4043610